Method And System For Two-Dimensional Mode-Matching Grating Couplers

ABSTRACT

Methods and systems for two-dimensional mode-matching grating couplers may include in a photonic chip comprising a grating coupler at a surface of the photonic chip, the grating coupler having increased scattering strength in a direction of a light wave traveling through the grating coupler: receiving an optical signal from a first direction within the photonic chip; and scattering the optical signal out of the surface of the photonic chip. A second optical signal may be received in the grating coupler from a second direction within the photonic chip. The second optical signal may be scattered out of the surface of the photonic chip. The increasing scattering strength may be configured by increased width scatterers along a direction perpendicular to the direction of light travel. The increased scattering strength may be configured by a transition of shapes of scatterers in the grating coupler.

CROSS-REFERENCE TO RELATED APPLICATIONS/INCORPORATION BY REFERENCE

This application claims priority to and the benefit of U.S. ProvisionalApplication 62/606,140 filed on Apr. 19, 2017, which is herebyincorporated herein by reference in its entirety.

FIELD

Aspects of the present disclosure relate to electronic components. Morespecifically, certain implementations of the present disclosure relateto methods and systems for two-dimensional mode-matching gratingcouplers.

BACKGROUND

Conventional approaches for optical grating couplers may be costly,cumbersome, and/or inefficient—e.g., they may be complex and/or timeconsuming, and/or may introduce asymmetry.

Further limitations and disadvantages of conventional and traditionalapproaches will become apparent to one of skill in the art, throughcomparison of such systems with some aspects of the present disclosureas set forth in the remainder of the present application with referenceto the drawings.

BRIEF SUMMARY

System and methods are provided for two-dimensional mode-matchinggrating couplers, substantially as shown in and/or described inconnection with at least one of the figures, as set forth morecompletely in the claims.

These and other advantages, aspects and novel features of the presentdisclosure, as well as details of an illustrated embodiment thereof,will be more fully understood from the following description anddrawings.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1A is a block diagram of a photonically-enabled integrated circuitwith two-dimensional mode-matching grating couplers, in accordance withan example embodiment of the disclosure.

FIG. 1B is a diagram illustrating an exemplary photonically-enabledintegrated circuit, in accordance with an example embodiment of thedisclosure.

FIG. 1C is a diagram illustrating a photonically-enabled integratedcircuit coupled to an optical fiber cable, in accordance with an exampleembodiment of the disclosure.

FIG. 2 is a schematic illustrating top views of one- and two-dimensionalgrating couplers, in accordance with an example embodiment of thedisclosure.

FIG. 3 illustrates one- and two-dimensional grating couplers with modematching, in accordance with an example embodiment of the disclosure.

FIG. 4 illustrates a two-dimensional mode-matching grating, inaccordance with an example embodiment of the disclosure.

FIG. 5 shows examples of two-dimensional mode-matching grating couplerswith shape transitions, in accordance with an embodiment of thedisclosure.

FIG. 6 shows an example of a two-dimensional mode-matching gratingcoupler with shape transitions that result in merging scatterers, inaccordance with an embodiment of the disclosure.

DETAILED DESCRIPTION

As utilized herein the terms “circuits” and “circuitry” refer tophysical electronic components (i.e. hardware) and any software and/orfirmware (“code”) which may configure the hardware, be executed by thehardware, and or otherwise be associated with the hardware. As usedherein, for example, a particular processor and memory may comprise afirst “circuit” when executing a first one or more lines of code and maycomprise a second “circuit” when executing a second one or more lines ofcode. As utilized herein, “and/or” means any one or more of the items inthe list joined by “and/or”. As an example, “x and/or y” means anyelement of the three-element set {(x), (y), (x, y)}. In other words, “xand/or y” means “one or both of x and y”. As another example, “x, y,and/or z” means any element of the seven-element set {(x), (y), (z), (x,y), (x, z), (y, z), (x, y, z)}. In other words, “x, y and/or z” means“one or more of x, y and z”. As utilized herein, the term “exemplary”means serving as a non-limiting example, instance, or illustration. Asutilized herein, the terms “e.g.,” and “for example” set off lists ofone or more non-limiting examples, instances, or illustrations. Asutilized herein, circuitry or a device is “operable” to perform afunction whenever the circuitry or device comprises the necessaryhardware and code (if any is necessary) to perform the function,regardless of whether performance of the function is disabled or notenabled (e.g., by a user-configurable setting, factory trim, etc.).

FIG. 1A is a block diagram of a photonically-enabled integrated circuitwith mode converters for grating couplers, in accordance with an exampleembodiment of the disclosure. Referring to FIG. 1A, there is shownoptoelectronic devices on a photonically-enabled integrated circuit 130comprising optical modulators 105A-105D, photodiodes 111A-111D, monitorphotodiodes 113A-113H, and optical devices comprising couplers103A-103K, optical terminations 115A-115D, grating couplers 117A-117H,and mode converters 121. There are also shown electrical devices andcircuits comprising amplifiers 107A-107D, analog and digital controlcircuits 109, and control sections 112A-112D. The amplifiers 107A-107Dmay comprise transimpedance and limiting amplifiers (TIA/LAs), forexample.

In an example scenario, the photonically-enabled integrated circuit 130comprises a complementary metal oxide semiconductor (CMOS) photonics diewith a laser assembly 101 coupled to the top surface of the IC 130. Thelaser assembly 101 may comprise one or more semiconductor lasers withisolators, lenses, and/or rotators for directing one or more CW opticalsignals to the coupler 103A. The photonically enabled integrated circuit130 may comprise a single chip, or may be integrated on a plurality ofdie, such as one or more electronics die and one or more photonics die.

Optical signals are communicated between optical and optoelectronicdevices via optical waveguides 110 fabricated in thephotonically-enabled integrated circuit 130. Single-mode or multi-modewaveguides may be used in photonic integrated circuits. Single-modeoperation enables direct connection to optical signal processing andnetworking elements. The term “single-mode” may be used for waveguidesthat support a single mode for each of the two polarizations,transverse-electric (TE) and transverse-magnetic (TM), or for waveguidesthat are truly single mode and only support one mode whose polarizationis TE, which comprises an electric field parallel to the substratesupporting the waveguides. Two typical waveguide cross-sections that areutilized comprise strip waveguides and rib waveguides. Strip waveguidestypically comprise a rectangular cross-section, whereas rib waveguidescomprise a rib section on top of a waveguide slab. Of course, otherwaveguide cross section types are also contemplated and are within thescope of the disclosure.

In an example scenario, the couplers 103A-103C may comprise low-lossY-junction power splitters where coupler 103A receives an optical signalfrom the laser assembly 101 and splits the signal to two branches thatdirect the optical signals to the couplers 103B and 103C, which splitthe optical signal once more, resulting in four roughly equal poweroptical signals.

The optical modulators 105A-105D comprise Mach-Zehnder or ringmodulators, for example, and enable the modulation of thecontinuous-wave (CW) laser input signal. The optical modulators105A-105D may comprise high-speed and low-speed phase modulationsections and are controlled by the control sections 112A-112D. Thehigh-speed phase modulation section of the optical modulators 105A-105Dmay modulate a CW light source signal with a data signal. The low-speedphase modulation section of the optical modulators 105A-105D maycompensate for slowly varying phase factors such as those induced bymismatch between the waveguides, waveguide temperature, or waveguidestress. Compensating for these slowly varying phase factors is referredto as the passive phase, or the passive biasing of the Mach-ZehnderModulator (MZM).

The outputs of the optical modulators 105A-105D may be optically coupledvia the waveguides 110 to the grating couplers 117E-117H. The couplers103D-103K may comprise four-port optical couplers, for example, and maybe utilized to sample or split the optical signals generated by theoptical modulators 105A-105D, with the sampled signals being measured bythe monitor photodiodes 113A-113H. The unused branches of thedirectional couplers 103D-103K may be terminated by optical terminations115A-115D to avoid back reflections of unwanted signals.

The grating couplers 117A-117H comprise optical gratings that enablecoupling of light into and out of the photonically-enabled integratedcircuit 130. The grating couplers 117A-117D may be utilized to couplelight received from optical fibers into the photonically-enabledintegrated circuit 130, and the grating couplers 117E-117H may beutilized to couple light from the photonically-enabled integratedcircuit 130 into optical fibers. The grating couplers 117A-117H maycomprise single polarization grating couplers (SPGC) and/or polarizationsplitting grating couplers (PSGC). In instances where a PSGC isutilized, two input, or output, waveguides may be utilized.

Grating couplers are devices in integrated optical circuits thatinterface light between telecommunication fibers and optical circuits.They comprise surface emitting elements that diffract guided light outof the plane of the circuit, where it can be collected with standardoptical fibers. In contrast to other coupling methods, such as end-facecoupling, grating couplers lend themselves to planar fabrication methodsand allow free placement of optical interfaces on the chip surface.

Additionally, two-dimensional (2D) gratings allow important multiplexingand de-multiplexing operations, that is, the combination of signals fromdifferent optical channels into one channel or the separation ofmultiple signals in the same channel into individual output channels,respectively. Two-dimensional gratings allow multiplexing in thepolarization, wavelength, and spatial domain. For instance, 2D gratingsmay combine light of two wavelengths from the chip 130 into a singleoutgoing fiber.

Typically, grating couplers are fabricated by etching the shape ofdiffractive elements into the waveguide, thus removing material from thewaveguide. For one-dimensional (1D) gratings, the diffractive shapes canbe as simple as an arrangement of equally-spaced lines, while fortwo-dimensional gratings, curved lines may be utilized.

In another exemplary embodiment illustrated in FIG. 1B, optical signalsmay be communicated directly into the surface of thephotonically-enabled integrated circuit 130 without optical fibers bydirecting a light source on an optical coupling device in the chip, suchas the light source interface 135 and/or the optical fiber interface139. This may be accomplished with directed laser sources and/or opticalsources on another chip flip-chip bonded to the photonically-enabledintegrated circuit 130.

The photodiodes 111A-111D in FIG. 1A may convert optical signalsreceived from the grating couplers 117A-117D into electrical signalsthat are communicated to the amplifiers 107A-107D for processing. In anexample embodiment of the disclosure, the photodiodes 111A-111D maycomprise high-speed heterojunction phototransistors, for example, andmay comprise germanium (Ge) in the collector and base regions forabsorption in the 1.3-1.6 μm optical wavelength range, and may beintegrated on a CMOS silicon-on-insulator (SOI) wafer.

In another example embodiment, the four transceivers shown in FIG. 1Amay be incorporated in two or more chips, as opposed to the single chipshown. For example, the electronics devices, such as the controlcircuits 109 and the amplifiers/TIAs 107A-107D, may be fabricated in anelectronics CMOS die while the optical and optoelectronic devices, suchas the photodetectors 111A-111D, grating couplers 117A-117H, and theoptical modulators 105A-105D may be incorporated on a photonics die,such as a silicon photonics interposer.

The analog and digital control circuits 109 may control gain levels orother parameters in the operation of the amplifiers 107A-107D, which maythen communicate electrical signals off the photonically-enabledintegrated circuit 130. The control sections 112A-112D compriseelectronic circuitry that enable modulation of the CW laser signalreceived from the splitters 103A-103C. The optical modulators 105A-105Dmay require high-speed electrical signals to modulate the refractiveindex in respective branches of a MZM, for example.

In operation, the photonically-enabled integrated circuit 130 may beoperable to transmit and/or receive and process optical signals. Opticalsignals may be received from optical fibers by the grating couplers117A-117D and converted to electrical signals by the photodetectors111A-111D. The electrical signals may be amplified by transimpedanceamplifiers in the amplifiers 107A-107D, for example, and subsequentlycommunicated to other electronic circuitry, not shown, in thephotonically-enabled integrated circuit 130. The grating couplers117A-117D may comprise two-dimensionally mode matching grating couplers,where the diffractive elements are tuned in each direction of lighttravel in the couplers, as shown further with respect to FIGS. 2-5.

Electrical signals, labeled as Electrical Signals In in FIG. 1A, maydrive the modulators 105A-105D to modulate the CW optical signalsreceived from the CW laser In 101, resulting in modulated opticalsignals to be communicated in or out of the chip by the grating couplers117A-117H

FIG. 1B is a diagram illustrating an exemplary photonically-enabledintegrated circuit, in accordance with an example embodiment of thedisclosure. Referring to FIG. 1B, there is shown thephotonically-enabled integrated circuit 130 comprising electronicdevices/circuits 131, optical and optoelectronic devices 133, a lightsource interface 135, a chip front surface 137, an optical fiberinterface 139, CMOS guard ring 141, and a surface-illuminated monitorphotodiode 143.

The light source interface 135 and the optical fiber interface 139comprise grating couplers, for example, that enable coupling of lightsignals via the CMOS chip surface 137. Coupling light signals via thechip surface 137 enables the use of the CMOS guard ring 141 whichprotects the chip mechanically and prevents the entry of contaminantsvia the chip edge.

The electronic devices/circuits 131 comprise circuitry such as theamplifiers 107A-107D and the analog and digital control circuits 109described with respect to FIG. 1A, for example. The optical andoptoelectronic devices 133 comprise devices such as the couplers103A-103K, optical terminations 115A-115D, grating couplers 117A-117H,optical modulators 105A-105D, high-speed heterojunction photodiodes111A-111D, and monitor photodiodes 113A-113I.

FIG. 1C is a diagram illustrating a photonically-enabled integratedcircuit coupled to an optical fiber cable, in accordance with an exampleembodiment of the disclosure. Referring to FIG. 1C, there is shown thephotonically-enabled integrated circuit 130 comprising the chip surface137, and the CMOS guard ring 141. There is also shown a fiber-to-chipcoupler 145, an optical fiber cable 149, and an optical source assembly147.

The photonically-enabled integrated circuit 130 comprises the electronicdevices/circuits 131, the optical and optoelectronic devices 133, thelight source interface 135, the chip surface 137, and the CMOS guardring 141 may be as described with respect to FIG. 1B, for example.

In an example embodiment, the optical fiber cable may be affixed, viaepoxy for example, to the CMOS chip surface 137. The fiber chip coupler145 enables the physical coupling of the optical fiber cable 149 to thephotonically-enabled integrated circuit 130. In another examplescenario, the IC 130 may comprise photonic devices on one die, such as aphotonics interposer, and electrical devices on an electronics die, bothof which may comprise CMOS die.

FIG. 2 is a schematic illustrating top views of one- and two-dimensionalgrating couplers, in accordance with an example embodiment of thedisclosure. Referring to FIG. 2, there is shown a one-dimensionalgrating coupler 200 and a two-dimensional grating coupler 210. In anexample embodiment, the darker regions of FIG. 2 comprise silicon layer201 while the white portions of FIG. 2 comprise dielectric gratings203A-203C, typically comprising silicon dioxide that may be depositedfollowing the removal of some of the silicon 201, although othersemiconductor and dielectric materials may be utilized.

To define the direction of the outgoing light, the arrangement of thediffractive elements, the grating lines 203A-203C in FIG. 2, generallyneed to match the propagation of the guided wave and the outgoing wave.For one-dimensional gratings, an arrangement of lines is sufficient, asindicated by oxide lines 203A, while two-dimensional gratings are oftenconstructed by imposing two 1D gratings in different directions on eachother, as illustrated by grating lines 203B and 203C.

For efficient systems, minimizing loss is an important goal of gratingcoupler design. Loss in such devices mainly stems from two independentmechanisms: 1) losses to the substrate due to the imperfect directivityof the coupler and 2) mode-mismatch loss due to imperfect overlapbetween the fiber mode and the light profile produced by the grating.Substrate loss may be influenced by grating geometry parameters, such aswaveguide thickness and etch depth. The minimization of mode-mismatchmay be accomplished through careful design of the diffractive elementsalong the propagation direction of the light.

To minimize coupling loss, the profile of the out-coupled light needs tobe matched to the mode profile of the fiber used for light collection.In one-dimensional gratings, the design process for the diffractiveelements is comparatively straightforward and supported by theoreticalmodels. The scattering strength of the diffractive elements, that is theamount of light coupled out of the waveguide per micrometer, may beconfigured to increase as the light propagates in the grating.

FIG. 3 illustrates one- and two-dimensional grating couplers with modematching, in accordance with an example embodiment of the disclosure.Referring to FIG. 3, there is shown a one-dimensional grating coupler300 and two-dimensional grating coupler 310, both with mode matching.

The grating coupler 300 shows that with one-dimensional gratings 303A,mode matching can be achieved by increasing the widths of the lines inthe direction of the light flow. Following the theoretical predictionfor the required scattering strength, as shown by the scatteringstrength inset adjacent to the grating coupler 300, increasing the widthof the diffractive gratings 303A yields an optimum coupling efficiency.As with FIG. 2, the darker regions of FIG. 3 comprise silicon layer 301while the white portions of FIG. 3 comprise dielectric gratings 303A and303B, typically comprising silicon dioxide that may be depositedfollowing the removal of some of the silicon 301, although othersemiconductor and dielectric materials may be utilized.

In two-dimensional gratings, light is travelling in different directionssimultaneously in the grating. This often poses conflicting constraintson the design of the diffractive elements that project differentscattering strengths in different directions at the same time, dependingon their position in the grating. In this respect, two-dimensionalgratings are not overlaps of two one-dimensional gratings. To achievemode-matching in two-dimensional gratings, and thus achieve minimumloss, each of the two light flows in the photonic circuit needs toexperience at each point the correct scattering strength in itsdirection. In fact, each individual diffractive element has uniquecharacteristics depending on its position in the two-dimensionalgrating.

Two-dimensional mode-matching gratings vary the scattering strength oftheir diffractive elements along the individual propagation directionsof the light for improved mode overlap with the collecting opticalfiber. Key design parameters for such gratings are (i) diffractiveelements that project two different scattering strengths in the twodirections involved, and (ii) exhibit the correct transition of theirshapes over the area of the grating. By properly adjusting theseparameters, gratings built from diffractive shapes that observe modematching in two directions simultaneously can be developed, thusminimizing loss.

In the two-dimensional grating coupler 310, the gratings 303B aredifferent across the area of the coupler 301, in both direction. Forexample, for light flow in the vertical direction, the gratings rangefrom a narrow width to a wider width in the direction of light travel.Similarly, for light arriving in the horizontal direction to the coupler310, the gratings 303B range from narrow to wider widths in thedirection of light flow.

Therefore, as shown in the insets for the one-dimensional grating 300and two-dimensional grating 310, the scattering strength increases aseach optical mode travels along the direction of travel. Therefore, inthe upper right corner of the two-dimensional grating 310, where theoptical modes have traveled the farthest from the inputs, the highestscattering strength in both directions is obtained.

FIG. 4 illustrates a two-dimensional mode-matching grating, inaccordance with an example embodiment of the disclosure. Referring toFIG. 4, there is shown two-dimensional grating coupler 400 illustratingthe configuration of scattering strength along the two axes of opticalwave travel.

FIG. 4 shows a detailed top view of a two-dimensional mode-matchinggrating coupler 400 with gratings 403 formed in silicon layer 401. andoutlines characteristics to be followed in the design process. Along the45-degree axis of symmetry 405 shown by the dashed line, diffractiveelements scatter symmetrically in both directions. While FIG. 4 depictssquare-shaped elements along this axis, other embodiments may utilizeany symmetric shape such as circles, rings, diamond shapes, crosses, andmore complex structures. Additionally, the basic shape allows modulationof the scattering strength along the symmetry axis, for example byvarying its size or form.

Away from the axis of symmetry, non-symmetric elements may be utilized,with the degree of asymmetry increasing with their distance from theaxis. The most asymmetric points are thus at the top-left andbottom-right corner of the two-dimensional grating coupler 400, wherelarge scattering strength is needed in only one direction. Suchdiffractive elements may, for instance, be created from narrowrectangular shapes.

Between the corners and the axis of symmetry, a shape transition may beemployed that closely follows the design parameter for the scatteringstrength in the two directions independently. The design parameters foreach diffractive element in the grating may be unique. The shapetransition is carefully modelled and parameterized in order to minimizecoupling loss.

As shown in the inset plots of FIG. 4, the scattering strength increasesin both directions of optical travel, with the maximum being at thefarthest distance from respective inputs, meaning the top right cornerof grating coupler 400 has the highest scattering strength in thevertical and horizontal direction.

Exemplary design goals for two-dimensional mode matching gratingcouplers are that (i) scattering strengths be different in twodirections and (ii) the scattering strength be modulated, indicates thatdiffractive elements of complex design that change their basic shape beutilized, depending on their position in the grating coupler 400.

A basic shape transition between symmetric and asymmetric diffractiveelements is the transition between squares and lines, for example. Tomodulate the coupling strength, the size (area fill factor) of thescatterers would generally need to be changed. However, this would alterthe propagation of the light in the grating couple 400 and would requireadjusting the position of the scatterers to maintain phase matching tothe outgoing light.

Another option to adjust the scattering strength is to utilize atransition between shapes while maintaining a constant fill factor. Forexample, circles and rings of the same area are both symmetric but havedifferent scattering strengths. Also, the polarization-dependentbehavior of the grating can be addressed using this type of scatterers.

While FIG. 4 illustrates optical signals from within the chip viawaveguides being scattered out of the chip using the grating coupler400, the reverse process is also possible. In this case, optical signalsmay be received from a vertical direction from the top surface of thechip, and scattered in directions opposite to the Light Flow directionsshown in FIG. 4, where the scattering strength decreases as the wavetravels in this direction out of the grating coupler and into awaveguide in a direction essentially parallel to the top surface of thechip. The asymmetries in the grating coupler also provide efficientscattering into the waveguides coupled to the grating coupler 400.

FIG. 5 shows examples of two-dimensional mode-matching grating couplerswith shape transitions, in accordance with an embodiment of thedisclosure. As shown in FIG. 5, there is shown two-dimensional gratingcouplers 500 and 510.

In grating coupler 500, square-to-line transitions are combined withhollow-to-filled rectangular shape transitions. While keeping the areafill factor constant, the size of the central hollow section reduces thescattering strength in this region, with hollow squares in the upperleft section of grating coupler 500 and completely filled squares in thelower right section. The elongation of the element towards a line-likeshape adjusts the symmetry. Therefore, the scattering strength increasesin the grating coupler in the direction of travel of the receivedoptical signals, with the maximum scattering strength in both directionsin the lower right corner of grating coupler 500.

Another option is illustrated by gating coupler 510, where transitionsbetween crosses and squares and between lines and squares may beemployed to adjust scattering strength, and asymmetry, as well as thepolarization characteristics of the grating. The minimal scatteringstrength is from the crosses and more linear structures in the directionof travel, with the maximum scattering strength in the lower rightcorner of grating coupler 510, with the more symmetric squarescatterers. The arrows and associated text indicate the shape seen bylight traveling in that direction.

While FIG. 5 illustrates optical signals from within the chip viawaveguides being scattered out of the chip using the grating couplers500 or 510, the reverse process is also possible. In this case, opticalsignals may be received from a vertical direction from the top surfaceof the chip, and scattered in directions opposite to the Light Indirections shown in FIG. 5, where the scattering strength decreases asthe wave travels in this direction out of the grating coupler into awaveguide in a direction essentially parallel to the top surface of thechip. The asymmetries in the grating coupler also provide efficientscattering into the waveguides coupled to the grating couplers 500 and510.

FIG. 6 illustrates a grating coupler with shape transitions that resultin merging scatterers for improved mode matching, in accordance with anexample embodiment of the disclosure. Referring to FIG. 6, there isshown grating coupler 600 comprising mode converters 601 and gratings603, with the inset on the right being a close-up view of the gratings603. The mode converters 601 may comprise taper structures having achange of material in the top part of the waveguide, such as the removalof silicon material in a silicon waveguide, for example, to aconfigurable depth, with a configurable width and spacing. Modeconverters are further disclosed in U.S. patent application Ser. No.15/945,370, which is hereby incorporated by reference in its entirety.

Mode matching gratings allow the use of mode converters to replace thehard interface between grating area and waveguide with a gradualtransition that the light can follow avoiding parasitic effects such asscattering or reflection. FIG. 6 shows a mode matching grating combinedwith elongated tapers, mode converters 601, in the propagation directionof the light as one possible example of such a mode converter.

Shape transitions are not necessarily restricted to one unit cell. Theycan also connect to neighboring unit cells to cater for a wider rangecoupling strength. Lines have the strongest possible scattering strengthin one direction. By merging neighboring cells, the appearance becomesmore line-like, which provides a wider range of scattering strengths.This can be of particular importance to manage restrictions infabrication, such as the minimum allowed size of features forlithography and etching processes, while providing a wide range ofscattering strengths to optimize mode matching.

As shown in the inset of FIG. 6, the square or rectangular structures605 in the lower left corner gradually switch to lines 607 in the upperright corner with some of the squares merging with neighboring squaresusing the narrow merging elements 609 between the squares 605, althoughthese structures are not limited to square or rectangular shapes, butcould also be rounded or diamond-like, for example. The merging elements609 may gradually increase in width until they are the width of thelines 607, thereby providing a smooth transition from one shape toanother.

In an example embodiment of the disclosure, a method and system isdescribed for two-dimensional mode-matching grating couplers andcomprise, in a photonic chip comprising a grating coupler at a surfaceof the photonic chip, the grating coupler having increased scatteringstrength in a direction of a light wave traveling through the gratingcoupler: receiving an optical signal from a first direction within thephotonic chip; and scattering the optical signal out of the surface ofthe photonic chip. A second optical signal may be received in thegrating coupler from a second direction within the photonic chip.

The second optical signal may be scattered out of the surface of thephotonic chip. The increasing scattering strength may be configured byincreased width scatterers along a direction perpendicular to thedirection of light travel. The increased scattering strength may beconfigured by a transition of shapes of scatterers in the gratingcoupler. The shape of the scatterers may transition from crosses tosquares, from hollow to filled shapes, and/or from squares or othershapes to lines. The transition from squares to lines may include narrowmerging elements between neighboring. The photonic chip may be acomplementary metal oxide semiconductor (CMOS) chip.

In another example embodiment, a method and system is described fortwo-dimensional mode-matching grating couplers and may comprise, in aphotonic chip comprising a grating coupler at a surface of the photonicchip, the grating coupler having increased scattering strength in firstand second directions of light waves traveling through the gratingcoupler: receiving a first optical signal from the first directionwithin the photonic chip; receiving a second optical signal from thesecond direction within the photonic chip; and scattering the first andsecond optical signals out of the surface of the photonic chip.

In another example embodiment, a method and system is described fortwo-dimensional mode-matching grating couplers and may comprise, in aphotonic chip comprising a grating coupler at a surface of the photonicchip, the grating coupler having decreased scattering strength in adirection of light waves traveling through the grating coupler:receiving an optical signal from the surface of the photonic chip viathe grating coupler; and scattering the optical signal into a waveguidecoupled to the grating coupler, the optical signal communicated in adirection parallel to the surface of the photonic chip.

While the present disclosure has been described with reference tocertain embodiments, it will be understood by those skilled in the artthat various changes may be made and equivalents may be substitutedwithout departing from the scope of the present invention. In addition,many modifications may be made to adapt a particular situation ormaterial to the teachings of the present invention without departingfrom its scope. Therefore, it is intended that the present invention notbe limited to the particular embodiment disclosed, but that the presentinvention will include all embodiments falling within the scope of theappended claims.

What is claimed is:
 1. A method for communication, the methodcomprising: in a photonic chip comprising a grating coupler at a surfaceof the photonic chip, the grating coupler having increased scatteringstrength in a direction of a light wave traveling through the gratingcoupler: receiving an optical signal from a first direction within thephotonic chip; and scattering the optical signal out of the surface ofthe photonic chip.
 2. The method according to claim 1, comprisingreceiving a second optical signal in the grating coupler from a seconddirection within the photonic chip.
 3. The method according to claim 2,comprising scattering the second optical signal out of the surface ofthe photonic chip.
 4. The method according to claim 1, wherein theincreasing scattering strength is configured by increased widthscatterers along a direction perpendicular to the direction of lighttravel.
 5. The method according to claim 1, wherein the increasedscattering strength is configured by a transition of shapes ofscatterers in the grating coupler.
 6. The method according to claim 5,wherein the shape of the scatterers transitions from crosses to squares.7. The method according to claim 5, wherein the shape of the scattererstransition from hollow to filled shapes.
 8. The method according toclaim 5, wherein the shape of the scatterers transition from squares tolines.
 9. The method according to claim 8, wherein the transition fromsquares to lines includes narrow merging elements between squares. 10.The method according to claim 1, wherein the photonic chip comprises acomplementary metal oxide semiconductor (CMOS) chip.
 11. A system forcommunication, the system comprising: a photonic chip comprising agrating coupler at a surface of the photonic chip, the grating couplerhaving increased scattering strength in a direction of a light wavetraveling through the grating coupler, the photonic chip operable to:receive an optical signal from a first direction within the photonicchip; and scatter the optical signal out of the surface of the photonicchip.
 12. The system according to claim 11, wherein the photonic chip isoperable to receive a second optical signal in the grating coupler froma second direction within the photonic chip.
 13. The system according toclaim 12, wherein the photonic chip is operable to scatter the secondoptical signal out of the surface of the photonic chip.
 14. The systemaccording to claim 11, wherein the increasing scattering strength isconfigured by increased width scatterers along a direction perpendicularto the direction of light travel.
 15. The system according to claim 11,wherein the increased scattering strength is configured by a transitionof shapes of scatterers in the grating coupler.
 16. The system accordingto claim 15, wherein the shape of the scatterers transitions fromcrosses to squares.
 17. The system according to claim 15, wherein theshape of the scatterers transition from hollow to filled shapes.
 18. Thesystem according to claim 15, wherein the shape of the scattererstransition from squares to lines.
 19. The system according to claim 18,wherein the transition from squares to lines includes narrow mergingelements between squares.
 20. A method for communication, the methodcomprising: in a photonic chip comprising a grating coupler at a surfaceof the photonic chip, the grating coupler having decreased scatteringstrength in a direction of light waves traveling through the gratingcoupler: receiving an optical signal from the surface of the photonicchip via the grating coupler; and scattering the optical signal into awaveguide coupled to the grating coupler, the optical signalcommunicated in a direction parallel to the surface of the photonicchip.